Researchers led by Assoc. Prof. Dr. Savaş Taşoğlu from the Department of Mechanical Engineering at Koç University have ...
Heat limits sub-10 nm chips, but current tools miss nanoscale effects or run too slowly. New modeling bridges atom-level ...
Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...
For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...
Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...