Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

VENTURA, Calif.--(BUSINESS WIRE)--Nexa3D, the ultrafast polymer 3D printing leader, announced today at Formnext, the immediate availability of its QLS 260 industrial laser sintering system as well as ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...

Innovations in alumina ceramic production techniques can increase the utilization of alumina ceramics in industrial applications. For instance, simple alumina components, such as alumina discs, can be ...

With the growing global demand for clean energy and efficient energy conversion technologies, thermoelectric technology has attracted significant attention due to its ability to directly convert waste ...

NORTHBROOK, Ill.--(BUSINESS WIRE)--M. Holland Company, a leading distributor of thermoplastic resins and 3D printing materials, announced its 3D Printing group has partnered with Advanced Laser ...