Aehr Test Systems Touts AI Burn-In Edge, Sees H2 Bookings Jump to $60M–$80M

Aehr Test Systems (NASDAQ:AEHR) used a recent presentation to outline its position in semiconductor reliability testing, with ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

ACM Research Updates 2025 Revenue Outlook and Provides Initial Outlook for 2026 Revenue

ACM plans to release its fourth quarter and full year 2025 financial results in late February 2026. The 2025 revenue outlook included in this press release is preliminary. Actual fourth quarter and ...
Seeking Alpha

ACM Research Expands Advanced Packaging Portfolio with Introduction of Frame Wafer Cleaning Tool

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...
Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
Morningstar

Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, ...
Digi Times

South Korea initiates major R&D project to boost chips packaging competitiveness

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...
ksn.com

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes

CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for soft-pad ...
The Motley Fool

Nvidia Is Leading the Artificial Intelligence (AI) Charge, But These 2 Companies Are Rising Stars

One of the big bottlenecks in AI chip production today is in advanced packaging. Advanced packaging technologies are exploding in popularity for AI systems and "chiplet" architectures. These two under ...
Business Insider

ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Digi Times

India-based OSAT secures wafer-level packaging technology

RRP Electronics, supported by cricket legend Sachin Tendulkar, has partnered with Deca Technologies to enhance India's semiconductor industry. This collaboration integrates advanced packaging ...